Jingtai Shares: Bringing PCT2835 Series to 2014 High-tech LED Lighting Exhibition

[Text|High-tech LED reporter Gan Qin] In the LED packaging process, it can reduce the production cost, and plays a key role in the heat conduction is the bracket material. The current scaffold materials are mainly composed of plastic, copper and electroplating, and the key to heat resistance lies in plastic materials. At present, the main application materials are PPA, PCT, EMC and so on.

"The main function of the package is to protect and improve the reliability of the chip. Therefore, the choice of package material is particularly important." Dr. Shao Pengrui, Technical Director of Jingtai Co., Ltd. said, "PCT materials contain about 20% fiber, can resist UV, have lower Water absorption and molding shrinkage."

Shao Pengrui introduced that the company's PCT materials are mainly driven by more than 1 watt, mainly used in high-power lighting such as street lamps, mining lamps and tunnel lights. "PCT materials are superior to existing PPA in high temperature withstand capability, high temperature long-term yellowing, reflectivity, UV irradiation, and can be used for large outdoor LED screen production and have good environmental adaptability."

In addition, Jingtai shares also passed the LM-80 test, which concluded that the PCT 1W products did not lose to EMC 1W products. And the price of PCT raw materials is more advantageous than EMC, and the future market prospects are very clear.

The high-profile LED industry event--2014 Gaogong LED Lighting Exhibition will be held at the Guangzhou Pazhou Canton Fair Complex on September 26-28. At that time, Jingtai will be unveiled with the PCT2835 series.

Shao Pengrui believes that the future development trend of LED will continue to move along the direction of high current and high power. Existing materials will still face bottlenecks such as high temperature resistance, long time high temperature operation, yellowing, UV, etc. Therefore, the rapid introduction of PCT new materials has been Become the leading direction of application development for packaging companies.

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