Packaging technology trends will change. In the three key words of packaging technology, "high density", "high speed and high frequency" and "low cost", the realization of "high density" is becoming more and more difficult. For example, in the 2009 edition of the "Japan Packaging Technology Development Blueprint" published by the Japan Electronic Information Technology Industry Association (JEITA) in June 2009, the minimum spacing of semiconductor packages is required to reach 0.3mm in 2012, until the forecast deadline of 2018. Will stay here (Figure 1). In the 2007 edition, there are 0.4mm in 2010 and 0.2mm in 2016. Note 1) The results of the questionnaire survey on the development blueprint show that “the requirement of 0.15mm spacing has appeared in the 2007 edition, but it did not appear in the 2009 edition†(JEITAJisso Strategic Special Committee/Packaging Technology Development Blueprint Group Machine Assembly Work Group supervisor, Ren Tianxiang). In addition, it was pointed out that there is no requirement for the "0201" component, and the "0402" component is "not as good as before" and "unexplained."
However, in the future, even if the density is continuously increased, it is impossible to simultaneously satisfy the high frequency and low cost required for high speed. There are two reasons for this. First, the market is more demanding to lower costs and support high frequencies. Second, the printed backplane technology has been saturated. In terms of printed circuit board technology, individual technologies for reducing the pitch have been introduced. However, "combining these technologies is still unable to meet the high frequency and cost that users - assembly manufacturers expect" (packaging technicians of portable product manufacturers).
However, in the future, even if the density is continuously increased, it is impossible to simultaneously satisfy the high frequency and low cost required for high speed. There are two reasons for this. First, the market is more demanding to lower costs and support high frequencies. Second, the printed backplane technology has been saturated. In terms of printed circuit board technology, individual technologies for reducing the pitch have been introduced. However, "combining these technologies is still unable to meet the high frequency and cost that users - assembly manufacturers expect" (packaging technicians of portable product manufacturers).
A flexible printed circuit board is a type of PCB designed to meet the needs of flexible electronic circuits. Originally designed flexible printed circuits to replace traditional wiring harnesses.
Flexible printed circuits are produced using flexible laminates. The flexible laminate holds the conductive foil as well as the dielectric substrate. Flexible circuit boards can be three-dimensionally routed and can be appropriately shaped to fit the available space.
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