On April 12th, Hisense’s spring 2012 new product launch conference released a number of new smart TV products in Beijing 798 in the form of “Experience Conferenceâ€. These smart new TVs have a system-level TV social application – “onlookersâ€, through which users can form “circles†to share videos, music, pictures and more.
This time, Hisense also released three new series of smart TV products, XT770, K580 and K560. These new products have realized richer content selection, simpler control experience, and created a cross-space communication sharing platform for customers. In the launch of “Big Smart TVâ€, Hisense also released four new “small TV†I'TV products, M1101AT, M1101AS, M170AT and M170AS.
Another highlight that can't be missed on the spot is Hisense's unique multi-screen interactive feature. It is the dream of many users to realize that TV is not restricted by space, distance and content at any time, anywhere, and at any time. On-site Hisense focused on the interaction between I'TV to TV, Phone to TV, and I'TV, Phone and TV. This kind of easy connection between TV, computer, mobile phone and I'TV devices is called “multi-screen interaction†in the industry.
With the continuous upgrading of TV intelligent technology, "intelligent experience" has become the focus of consumers' most attention. This time, Hisense’s smart TV application uses intelligent interaction methods such as semantic recognition to complete volume adjustment, channel change operation, content search matching and pattern recognition through natural language, and adopts ultra-narrow bezel design with independent patent technology. Higher 3D display technology.
0.8mm Pin Header
Antenk 0.8mm Pitch Male Header series is a fine pitch, low profile, single/dual/three/four row, PCB mounted connector set intended for limited space applications or where total weight is a factor. Our specially tooled insulators and contacts maintain consistent high quality through our automated production processes. Each series is available in thru-hole PCB or SMT mounting and plated tin, gold or selective gold as specified.
0.8mm Pin Header Options
Number of Rows
1/Single
2/Double
3/Three
4/Quad
Number of Positions
2 Position
3 Position
4 Position
5 Position
6 Position
8 Position
10 Position
12 Position
14 Position
15 Position
16 Position
17 Position
20 Position
Termination Style
SMD/SMT
Through Hole
Mounting Angle
Right Angle
Straight
0.8mm Pin Header Specifications:
Material: Standard Hi-Temp insulator: Nylon 6T, rated UL94V-0
Insulator Color: Black
Contacts: Phosphor Bronze
Plating:
U = Gold over nickel underplate
SG = Gold over nickel underplate on
contact area, tin over copper underplate on tails.
T = Tin over copper underplate overall.
Electrical:
Operating voltage: 250V AC max.
Current rating: 1 Amp max
Contact resistance: 20 mΩ max. initial
Insulation resistance: 5000 MΩ min.
Dielectric withstanding voltage: 1000V AC for 1 minute
Mechanical:
Mating durability: 500 cycles min.
Temperature Ratings: Operating temperature: -40°C to +105°C
Max process temp: 230°C for 30 ~ 60 seconds (260°C for 10 seconds)
Soldering process temperature: 260°C
Packaging:
Anti-ESD plastic bags or tubes
Approvals and Certifications:
UL Recognized File no. E224053
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ShenZhen Antenk Electronics Co,Ltd , https://www.antenksocket.com