High brightness light emitting diodes (HB LEDs ) combine high output, high efficiency and long life. Figure 1 shows the electrical IV characteristics of a typical diode. Although a complete test procedure can include hundreds of points, probing for a limited sample is generally sufficient to provide good value. Many HB LED tests require a known current source to drive the device and measure its voltage accordingly, or vice versa. Simultaneous signal sources and measurement functions that can be synchronized can speed up system setup and increase throughput. Testing can be done at the die level (wafer and package) or module/subassembly level. At the module/subassembly level, HBLEDs can be connected in series and/or in parallel; therefore, higher currents are typically required, sometimes up to 50A or higher, depending on the application. Some die-level tests use currents in the range of 5 to 10 A, depending on the die size.
Figure 1 Typical HBLED DC IV curve and test points (not drawn to scale)
1 forward voltage test
To understand how new structural unit materials, such as graphene, carbon nanotubes, silicon nanowires, or quantum dots, can be used in future electronic devices, it is necessary to measure resistance and resistance over a wide range. Measurement methods for rate, mobility, and conductivity. This often requires measurements of very low currents and voltages. For engineers who are trying to develop and commercialize these next-generation materials, the ability to make accurate, repeatable measurements at the nanoscale is extremely important.
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